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Industrial
|
Layer coverage |
Single side to 50 layers vias |
| 3+N+3 HDI PCB | |
| ≤18L Anylayer | |
| Metal core | |
| FPC | |
| Rigid-Flex | |
| Board thickness | Double side:0.1mm to 10mm Mutil layer 0.3mm up |
| Max copper thickness | (Inner layer)8oz, (Outer layer) 12oz |
| Min trace/width | (Line width/line spacing) 0.075mm |
| Min hole tolerance | (PTH) ±0.05mm, (NPTH) ±0.05mm |
| Min hole size | Machine drilling 0.15mm, |
| Laser drilling 0.10mm . | |
| Surface treatment | HALLF, Immersion silver, ENIG, ENPIG, Immersion Tin, Gold plating, OSP, Gold finger, Carbon |
|
Layer coverage |
1-6L |
| Materials | Polyimide, Polyester |
| Max copper thickness | 2oz |
| Min trace/width | 0.075mm/0.075mm |
| PCB thickness | 0.05-0.8mm |
| Surface treatment | OSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers |
